This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications. https://www.epoxyadhesiveglue.com/product/epoxy-underfill-chip-level-adhesives/
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Huizhou City, Guangdong,China
https://www.epoxyadhesiveglue.com/product/epoxy-underfill-chip-level-adhesives/
Birthday on December 02, 1993
Joined on December 02, 2022
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