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owtemperaturecuring Bio
This series is a one-component heat-curing epoxy resin for low temperature curing with good adhesion to a wide range of materials in a very short period of time. Typical applications include memory cards, CCD/CMOS program sets. Particularly suitable for thermosensitive components where low curing temperatures are required.
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owtemperaturecuring
china
https://www.deepmaterialcn.com/low-temperature-curing-epoxy-adhesive-for-sensitive-devices-and-circu
Birthday on April 04, 1990
Joined on November 13, 2022
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